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1. Main Production Roadmap: |
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2006 2007 Q1, 2008 Q2, 2008 Q3, 2008 Q4, 2008 Q1, 2009 Q2, 2009 |
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PCBA Assembly
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BT/EMS Engine Mode
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EMS
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Packing
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ODM/OEM
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2. Process Capability: |
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★ High-Speed SMT lines (SIEMENS Siplace D serial and Fuji NXT Machine, can satisfy 0201 and 01005 parts) and assembly lines which are the first class equipments in the electronic manufacturing field in the world. |
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| Section | Machine Type | Process capability |
| SMT | - Printer: MPM/DEK | - PCB Size: Max:450*328; Min.50*50 |
| - Mounter: Fuji NXT/Siemens D | - PCB Height: Max:4.5mm; Min:0.8mm | |
| - Reflow: ERSA 2-20 | - Chip size: Min: 0201 | |
| - AOI: VI 3K2/Agilent SJ-50 | - Connector: Min: 0.4mm Pitch | |
| - X-Ray: Phoenix 3D/SMG 2D | - BGA/CSP/ :Min: 0.3mm | |
| - Glue dispenser: Camelot /Asymtek |
- SOP/TSOP: Min: 0.4mm | |
| - QFP: Min: 0.4mm | ||
| - AOI: Online | ||
| - X-Ray: 2D/3D | ||
| - ROHS: Available | ||
| Assembly | - Flip/Slider assembly | |
| - Engine assembly | ||
| - Color box packing | ||
| - ACF/Hot Bar technology | ||
| - Wave Solder/DIP assembly | ||
| Testing | Mobile phone tester/RF tester: | - GSM |
| - CMU200/Agilent 8960 | - CDMA2000 | |
| - AnritsuMT8852B MT8860A | - TD-SCDMA | |
| - R&S CBT Blue Tooth | - WCDMA | |
| - Star point TD SP6010 | - Wi-Fi | |
| - Willtek4400 | - Blue Tooth | |
| - Network Analyzer | - WiMax. | |
| - Agilent E5062A | - MP4/video/audio/TP/RF/System/HDD testing |
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3. Equip introduction: |
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●SMT Machine |
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★FUJI NXT SMT Machine |
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★Siemens SMT Machine |
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●Testing Machine |
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GSM Testing Station
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CDMA Testing Station
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TD-SCDMA Testing Station
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LCD/Camera Tester
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Antenna RF Tester
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BT/FT Tester
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4. MES Traceability System: |
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MES Function Introduction |
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5. Vision of HZ BYD electronic Corp: |
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To become the most effective EMS Provider in the World with the most competition at quality, cost, flexibility and technology. |
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