Product Structure Application
★ Cell Phone ★ DSC & DV ★ PC ★ Pick Up ★ LCD Module ★ Camera Module ★ Backlight ★ Auto Electronic ★ Industrial Fields etc.
Equipments Process Capability   Spec&Technical Parameter Normal Special Surface Treatment Normal (μm) Layer 1~7   Tin plating 5~30 Minimume Circuit Width And Speace 0.075 mm 0.05 mm ENIG Ni:1.0~6.0 ; Au:0.03~0.10 PTH(Drill / Pad) 0.2/0.5 mm 0.15/0.35 mm Electro "Ni/Au" plating <soft> Ni:3~12 ; Au:0.03~0.80 Coverlay Misalignment Tolerance ±0.3mm(±0.2mm for circuit) ±0.2mm(±0.1mm for circuit) Electro "Ni/Au" plating<hard> Ni:3~12 ;Au:0.10~0.80 Photo-image Solder Resistance Misalignment Tolerance ±0.10mm for circuit ±0.05mm for circuit Electro "Au" plating 0.20~0.80 Outline Tolerance ±0.1mm ±0.05mm O.S.P. 0.20~0.50 Min Chip Size for SMT 0402 0201     Rigid Flex 4 layers 6 layers     Blind via 0.1 mm 0.075 mm
Main Customers
Achievement E-mail: BYDCPTG@BYD.COM Tel: +86-755-89888888 转69395

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