| 双面 FPC 18μm Copper Foil + 10μm Plating Copper |
普通规格 |
高级规格 |
| Space Between Circuit Centre(Pitch) |
≥0.20mm |
≥0.15mm |
| Circuit Width Tolerance |
±0.03mm |
±0.02mm |
| Space Tolerance Between Total Circuit |
≥±0.2%(Min±30μm) |
≥±0.1%(Min±20μm) |
| Outline Tolerance |
±0.1mm |
±0.05mm |
| Coverlay Excursion Tolerance |
±0.3mm(±0.2mm for circuit) |
±0.2mm(±0.1mm for circuit) |
| Printing Solder Resistance Excursion Tolerance |
±0.3mm(±0.2mm for circuit) |
±0.2mm(±0.1mm for circuit) |
| Exposal Solder Resistance Excursion Tolerance |
±0.15mm for circuit |
±0.07mm for circuit |
| Stiffener And 2-Side Adhesive Excursion Tolerance |
±0.5mm |
±0.1mm |
| Through Hole Diameter/Hole Pad Diameter (Circuit) |
≥Φ0.3mm/Φ0.6mm |
≥Φ0.15mm/Φ0.5mm |
